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 ispLSI 1048E
(R)
High-Density Programmable Logic Features
* HIGH DENSITY PROGRAMMABLE LOGIC -- 8,000 PLD Gates -- 96 I/O Pins, Twelve Dedicated Inputs -- 288 Registers -- High-Speed Global Interconnects -- Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. -- Small Logic Block Size for Random Logic -- Functionally and Pin-out Compatible to ispLSI 1048C TECHNOLOGY * HIGH PERFORMANCE -- fmax = 125 MHz Maximum Operating Frequency -- tpd = 7.5 ns Propagation Delay -- TTL Compatible Inputs and Outputs -- Electrically Eraseable and Reprogrammable -- Non-Volatile -- 100% Tested at Time of Manufacture * IN-SYSTEM PROGRAMMABLE -- In-System Programmable (ISPTM) 5V Only -- Increased Manufacturing Yields, Reduced Time-toMarket and Improved Product Quality -- Reprogram Soldered Devices for Faster Prototyping * OFFERS THE EASE OF USE AND FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS -- Complete Programmable Device Can Combine Glue Logic and Structured Designs -- Enhanced Pin Locking Capability -- Four Dedicated Clock Input Pins -- Synchronous and Asynchronous Clocks -- Programmable Output Slew Rate Control to Minimize Switching Noise -- Flexible Pin Placement -- Optimized Global Routing Pool Provides Global Interconnectivity * ispLSI DEVELOPMENT TOOLS ispVHDLTM Systems -- VHDL/Verilog-HDL/Schematic Design Options -- Functional/Timing/VHDL Simulation Options ispDS+TM VHDL Synthesis-Optimized Logic Fitter -- Supports Leading Third-Party Design Environments for Schematic Capture, Synthesis and Timing Simulation -- Static Timing Analyzer ispDSTM Software -- Lattice HDL or Boolean Logic Entry -- Functional Simulator and Waveform Viewer ISP Daisy Chain Download Software E2CMOS(R)
Functional Block Diagram
Output Routing Pool F7 F6 F5 F4 F3 F2 F1 F0 A0
Output Routing Pool
Output Routing Pool E7 E6 E5 E4 E3 E2 E1 E0 D7 D5
Output Routing Pool
0139G1A-isp
DQ
A1 A2 A3 A4 A5 A6 A7 B0 B1 B2 B3 B4 B5 B6 B7 Output Routing Pool
D6
Logic
DQ
Global Routing Pool (GRP)
Array
DQ
GLB
D4 D3 D2 D1 D0
DQ
C0 C1 C2 C3 C4 C5 C6 C7 Output Routing Pool
CLK
Description
The ispLSI 1048E is a High-Density Programmable Logic Device containing 288 Registers, 96 Universal I/O pins, 12 Dedicated Input pins, four Dedicated Clock Input pins, two dedicated Global OE input pins, and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 1048E features 5V in-system programmability and in-system diagnostic capabilities. The ispLSI 1048E offers nonvolatile reprogrammability of the logic, as well as the interconnect to provide truly reconfigurable systems. A functional superset of the ispLSI 1048 architecture, the ispLSI 1048E device adds two new global output enable pins and two additional dedicated inputs. The basic unit of logic on the ispLSI 1048E device is the Generic Logic Block (GLB). The GLBs are labeled A0, A1...F7 (see Figure 1). There are a total of 48 GLBs in the ispLSI 1048E device. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any other GLB on the device.
Copyright (c) 1998 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 681-0118; 1-800-LATTICE; FAX (503) 681-3037; http://www.latticesemi.com
July 1998
1048E_08
1
Specifications ispLSI 1048E
Functional Block Diagram
Figure 1. ispLSI 1048E Functional Block Diagram
I/O I/O I/O I/O 95 94 93 92 RESET
GOE 0 GOE 1
I/O I/O I/O I/O 91 90 89 88
I/O I/O I/O I/O 87 86 85 84
I/O I/O I/O I/O 83 82 81 80
IN IN 11 10
I/O I/O I/O I/O 79 78 77 76
I/O I/O I/O I/O 75 74 73 72
I/O I/O I/O I/O 71 70 69 68
I/O I/O I/O I/O 67 66 65 64
IN 9
IN 8
Input Bus Generic Logic Blocks (GLBs) F7 F6 Output Routing Pool (ORP) F5 F4 F3 F2 F1 F0 E7 E6
Input Bus Output Routing Pool (ORP) E5 E4 E3 E2 E1 E0
IN 7 IN 6 I/O 63 I/O 62 I/O 61 I/O 60
D7
I/O 0 I/O 1 I/O 2 I/O 3
A0 A1
Output Routing Pool (ORP)
D6
Output Routing Pool (ORP)
D5
I/O 59 I/O 58 I/O 57
D4 D3 D2 D1 D0
lnput Bus
Input Bus
I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 SDI/IN 0 MODE/IN 1
A2 A3 A4 A5 A6 A7 B0 B1 B2 B3 B4 B5 B6 B7
Global Routing Pool (GRP)
I/O 56 I/O 55 I/O 54 I/O 53 I/O 52 I/O 51 I/O 50 I/O 49 I/O 48
C0
C1
C2
C3
C4
C5
C6
C7
Clock Distribution Network
Output Routing Pool (ORP) Megablock Input Bus
ispEN/NC IN 2 SDO/ IN 3 I/O I/O I/O I/O 16 17 18 19 I/O I/O I/O I/O 20 21 22 23 I/O I/O I/O I/O 24 25 26 27 I/O I/O I/O I/O 28 29 30 31 IN SCLK/ I/O I/O I/O I/O 4 IN 5 32 33 34 35
Output Routing Pool (ORP) Input Bus
CLK 0 CLK 1 CLK 2 IOCLK 0 IOCLK 1
I/O I/O I/O I/O 36 37 38 39
I/O I/O I/O I/O 40 41 42 43
I/O I/O I/O I/O 44 45 46 47
YYYY 0123
0139F(2)-48B-isp
The device also has 96 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, registered input, latched input, output or bi-directional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise. Eight GLBs, 16 I/O cells, two dedicated inputs and one ORP are connected together to make a Megablock (see figure 1). The outputs of the eight GLBs are connected to a set of 16 universal I/O cells by the ORP. Each ispLSI 1048E device contains six Megablocks.
The GRP has, as its inputs, the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew. Clocks in the ispLSI 1048E device are selected using the Clock Distribution Network. Four dedicated clock pins (Y0, Y1, Y2 and Y3) are brought into the distribution network, and five clock outputs (CLK 0, CLK 1, CLK 2, IOCLK 0 and IOCLK 1) are provided to route clocks to the GLBs and I/O cells. The Clock Distribution Network can also be driven from a special clock GLB (D0). The logic of this GLB allows the user to create an internal clock from a combination of internal signals within the device.
2
Specifications ispLSI 1048E
Absolute Maximum Ratings 1
Supply Voltage Vcc. ................................. -0.5 to +7.0V Input Voltage Applied ........................ -2.5 to VCC +1.0V Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V Storage Temperature ................................ -65 to 150C Case Temp. with Power Applied .............. -55 to 125C Max. Junction Temp. (TJ) with Power Applied ... 150C
1. Stresses above those listed under the "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specifica tion is not implied (while programming, follow the programming specifications).
DC Recommended Operating Conditions
SYMBOL PARAMETER Supply Voltage Input Low Voltage Input High Voltage Commercial Industrial TA = 0C to + 70C TA = -40C to + 85C MIN. 4.75 4.5 0 2.0 MAX. 5.25 5.5 0.8 Vcc+1 UNITS V V V V
Table 2-0005/1048E
VCC VIL VIH
Capacitance (TA=25oC, f=1.0 MHz)
SYMBOL PARAMETER Dedicated Input, I/O, Y1, Y2, Y3, Clock Capacitance Y0 Clock Capacitance TYPICAL 8 15 UNITS pf pf TEST CONDITIONS VCC = 5.0V, VPIN = 2.0V VCC = 5.0V, VPIN = 2.0V
Table 2-0006/1048E
C1 C2
Data Retention Specifications
PARAMETER Data Retention Erase/Reprogram Cycles MINIMUM 20 10000 MAXIMUM - - UNITS Years Cycles
Table 2-0008/1048E
3
Specifications ispLSI 1048E
Switching Test Conditions
Input Pulse Levels Input Rise and Fall Time Input Timing Reference Levels Output Timing Reference Levels Output Load 3-state levels are measured 0.5V from steady-state active level. GND to 3.0V 3 ns 10% to 90% 1.5V 1.5V See Figure 2
Table 2-0003/1048E
Figure 2. Test Load
+ 5V R1 Device Output R2 CL* Test Point
Output Load Conditions (see Figure 2)
TEST CONDITION A B Active High Active Low Active High to Z at VOH -0.5V Active Low to Z at VOL +0.5V R1 470 470 470 R2 390 390 390 390 390 CL 35pF 35pF 35pF 5pF 5pF
Table 2-0004a
*CL includes Test Fixture and Probe Capacitance.
0213a
C
DC Electrical Characteristics
Over Recommended Operating Conditions
SYMBOL PARAMETER Output Low Voltage Output High Voltage Input or I/O Low Leakage Current IOL= 8 mA IOH = -4 mA 0V VIN VIL (Max.) CONDITION MIN. - 2.4 - - - - - - - TYP. - - - - - - - 175 175
3
MAX. UNITS 0.4 - -10 10 -150 -150 -200 - - V V A A A A mA mA
VOL VOH IIL IIH IIL-isp IIL-PU IOS1 ICC2, 4
1. 2. 3. 4.
Input or I/O High Leakage Current 3.5V VIN VCC ispEN Input Low Leakage Current 0V VIN VIL I/O Active Pull-Up Current Output Short Circuit Current Operating Power Supply Current 0V VIN VIL VCC = 5V, VOUT = 0.5V VIL = 0.0V, VIH = 3.0V Commercial
mA Industrial fCLOCK = 1 MHz Table 2-0007/1048E One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. Measured using twelve 16-bit counters. Typical values are at VCC = 5V and TA= 25C. Maximum I CC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum ICC .
4
Specifications ispLSI 1048E
External Timing Parameters
Over Recommended Operating Conditions
PARAMETER TEST COND.
4
#2 1 2 3 4 5 6 7 8 9
DESCRIPTION
1
-125 - - 125.0
1 tsu2 + tco1
-100 - - 100.0 71.0 125.0 6.5 - 0.0 7.5 - 0.0 - 6.5 - - - - 4.0 4.0 3.5 0.0 10.0 12.5 - - - - 6.5 - - 7.5 - 13.5 - 15.0 15.0 9.0 9.0 - - - - - -
-90 10.0 12.5 - - - -
MIN. MAX. MIN. MAX. MIN. MAX. 7.5 10.0 - - - - 4.5 - - 5.5 - 10.0 - 12.0 12.0 7.0 7.0 - - - -
UNITS ns ns MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
tpd1 tpd2 fmax (Int.) fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl tsu3 th3
1. 2. 3. 4.
A A A - - - A - - - - A - B C B C - - - -
Data Propagation Delay, 4PT Bypass, ORP Bypass Data Propagation Delay, Worst Case Path Clock Frequency with Internal Feedback 3 Clock Frequency with External Feedback ( Clock Frequency, Max. Toggle
90.9 71.0 125.0 6.5 -
)
91.0 167.0 5.5 - 0.0 6.5 - 0.0 - 5.0 - - - - 3.0 3.0
GLB Reg. Setup Time before Clock,4 PT Bypass GLB Reg. Clock to Output Delay, ORP Bypass GLB Reg. Hold Time after Clock, 4 PT Bypass GLB Reg. Setup Time before Clock
10 GLB Reg. Clock to Output Delay 11 GLB Reg. Hold Time after Clock 12 Ext. Reset Pin to Output Delay 13 Ext. Reset Pulse Duration 14 Input to Output Enable 15 Input to Output Disable 16 Global OE Output Enable 17 Global OE Output Disable 18 External Synchronous Clock Pulse Duration, High 19 External Synchronous Clock Pulse Duration, Low 20 21
I/O Reg. Setup Time before Ext. Sync Clock (Y2, Y3) 3.0 I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3) 0.0
Unless noted otherwise, all parameters use a GRP load of 4 GLBs, 20 PTXOR path, ORP and Y0 clock. Refer to Timing Model in this data sheet for further details. Standard 16-bit counter using GRP feedback. Reference Switching Test Conditions section.
5
USE 104 8E-100 F OR NEW DE SIGNS
6.5 - - 0.0 7.5 - 0.0 - 6.5 - - - 7.5 - 13.5 - 15.0 15.0 9.0 - - - - 9.0 - 4.0 4.0 4.0 0.0
(
1 twh + twl
)
Table 2-0030A/1048E
Specifications ispLSI 1048E
External Timing Parameters
Over Recommended Operating Conditions
PARAMETER TEST COND.
4
#2 1 2 3 4 5 6 7 8 9
DESCRIPTION
1
-70 - - 70.0
1 tsu2 + tco1
-50 - - 50.0 42.0 77.0 12.0 - 20.0 24.5 - - - -
MIN. MAX. MIN. MAX. 15.0 18.5 - - - - 7.0 - - 9.0 - 15.0 - 18.0 18.0 12.0 12.0 - - - -
UNITS ns ns MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
tpd1 tpd2 fmax (Int.) fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl tsu3 th3
1. 2. 3. 4.
A A A - - - A - - - - A - B C B C - - - -
Data Propagation Delay, 4PT Bypass, ORP Bypass Data Propagation Delay, Worst Case Path Clock Frequency with Internal Feedback 3 Clock Frequency with External Feedback ( Clock Frequency, Max. Toggle
)
56.0 100.0 9.0 - 0.0 11.0 - 0.0 - 10.0 - - - - 5.0 5.0 4.0 0.0
GLB Reg. Setup Time before Clock,4 PT Bypass GLB Reg. Clock to Output Delay, ORP Bypass GLB Reg. Hold Time after Clock, 4 PT Bypass GLB Reg. Setup Time before Clock
10 GLB Reg. Clock to Output Delay 11 GLB Reg. Hold Time after Clock 12 Ext. Reset Pin to Output Delay 13 Ext. Reset Pulse Duration 14 Input to Output Enable 15 Input to Output Disable 16 Global OE Output Enable 17 Global OE Output Disable 18 External Synchronous Clock Pulse Duration, High 19 External Synchronous Clock Pulse Duration, Low 20 21 I/O Reg. Setup Time before Ext. Sync Clock (Y2, Y3) I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3)
Unless noted otherwise, all parameters use a GRP load of 4 GLBs, 20 PTXOR path, ORP and Y0 clock. Refer to Timing Model in this data sheet for further details. Standard 16-bit counter using GRP feedback. Reference Switching Test Conditions section.
6
USE 104 8E-70 FO R NEW DE SIGNS
9.5 - - 0.0 - 14.5 0.0 - 12.0 - 20.5 - 24.0 24.0 13.0 - - - 6.5 6.5 6.5 0.0 - 16.0 - - - - 16.0
(
1 twh + twl
)
Table 2-0030B/1048E
Specifications ispLSI 1048E
Internal Timing Parameters1
PARAMETER Inputs #2 -125 DESCRIPTION -100 -90 MIN. MAX. MIN. MAX. MIN. MAX. - - 3.0 0.0 - - - - - - - - - - - - - - 0.1 4.5 - - - - 2.9 - - 0.3 1.9 - - 4.6 4.6 2.3 1.8 2.0 2.3 2.8 4.9 3.9 4.0 3.6 5.0 5.0 0.4 - - 2.3 4.9 3.9 5.4 4.0 1.0 0.0 - - 3.5 0.0 - - - - - - - - - - - - - - 0.5 5.3 - - - - 3.5 - - 0.3 2.3 - - 5.0 5.0 2.7 1.9 2.4 2.6 3.0 5.4 5.3 5.3 4.6 5.8 6.3 1.0 - - 2.5 6.2 4.5 7.2 4.7 1.0 0.0 - - 4.0 -0.5 - - - - - - - - - 0.5 2.5 - UNITS
25 I/O Register Hold Time after Clock 26 I/O Register Clock to Out Delay 27 I/O Register Reset to Out Delay 28 Dedicated Input Delay 29 GRP Delay, 1 GLB Load 30 GRP Delay, 4 GLB Loads 31 GRP Delay, 8 GLB Loads 32 GRP Delay, 16 GLB Loads 33 GRP Delay, 48 GLB Loads 34 4 Product Term Bypass Path Delay (Combinatorial) 35 4 Product Term Bypass Path Delay (Registered) 36 1 Product Term/XOR Path Delay 37 20 Product Term/XOR Path Delay 38 XOR Adjacent Path Delay 3 39 GLB Register Bypass Delay 40 GLB Register Setup Time before Clock 41 GLB Register Hold Time after Clock 42 GLB Register Clock to Output Delay 43 GLB Register Reset to Output Delay 44 GLB Product Term Reset to Register Delay 45 GLB Product Term Output Enable to I/O Cell Delay 46 GLB Product Term Clock Delay 47 ORP Delay 48 ORP Bypass Delay
DESIGNS
- 5.0 5.0 2.9 2.2 2.4 2.7 3.3 5.7 5.4 6.3 6.5 6.5 7.3 0.4 - - 2.0 6.3 5.0 5.7 5.2 1.0 0.0
tiobp tiolat tiosu tioh tioco tior tdin
GRP
22 I/O Register Bypass 23 I/O Latch Delay 24 I/O Register Setup Time before Clock
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck
ORP
torp torpbp
USE 104
- 0.1 - - - - 4.0 - - 6.4
1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros.
7
8E-100 F
- - - -
GLB
OR NEW
tgrp1 tgrp4 tgrp8 tgrp16 tgrp48
Table 2-0036A/1048E
Specifications ispLSI 1048E
Internal Timing Parameters1
PARAMETER Inputs #2 -70 DESCRIPTION -50 MIN. MAX. MIN. MAX. - - 4.1 -0.6 - - - - - - - - - - - - - - 0.1 8.5 - - - - 5.1 - - 0.6 3.6 - - 6.0 6.0 4.3 3.5 3.7 4.1 4.8 7.5 8.5 7.4 8.4 8.4 9.4 1.6 - - 2.0 6.3 6.1 6.8 6.4 2.0 0.0 - - 6.5 -0.7 - - - - - - - - - 0.7 4.7 - 7.0 7.0 - UNITS
28 Dedicated Input Delay 29 GRP Delay, 1 GLB Load 30 GRP Delay, 4 GLB Loads 31 GRP Delay, 8 GLB Loads 32 GRP Delay, 16 GLB Loads 33 GRP Delay, 48 GLB Loads 34 4 Product Term Bypass Path Delay (Combinatorial) 35 4 Product Term Bypass Path Delay (Registered) 36 1 Product Term/XOR Path Delay 37 20 Product Term/XOR Path Delay 38 XOR Adjacent Path Delay 3 39 GLB Register Bypass Delay 40 GLB Register Setup Time before Clock 41 GLB Register Hold Time after Clock 42 GLB Register Clock to Output Delay 43 GLB Register Reset to Output Delay 44 GLB Product Term Reset to Register Delay 45 GLB Product Term Output Enable to I/O Cell Delay 46 GLB Product Term Clock Delay 47 ORP Delay 48 ORP Bypass Delay
R NEW D ESIG
6.1 5.1 5.4 5.8 6.6 9.8 10.7 9.2 10.5 10.5 11.7 2.2 - - 3.0 7.3 7.9 10.0 8.3 2.5 0.0
tiobp tiolat tiosu tioh tioco tior tdin
GRP
22 I/O Register Bypass 23 I/O Latch Delay 24 I/O Register Setup Time before Clock 25 I/O Register Hold Time after Clock 26 I/O Register Clock to Out Delay 27 I/O Register Reset to Out Delay
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
tgrp1 tgrp4 tgrp8 tgrp16 tgrp48
GLB
t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck
ORP
torp torpbp
USE 104
- 0.0 - - - 11.5 - 6.9 - -
1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros.
8
8E-70 FO
- - - -
Table 2-0036B/1048E
NS
Specifications ispLSI 1048E
Internal Timing Parameters1
PARAMETER Outputs 50 Output Slew Limited Delay Adder 51 I/O Cell OE to Output Enabled 52 I/O Cell OE to Output Disabled 53 Global OE 54 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 55 Clock Delay, Y1 or Y2 to Global GLB Clock Line 56 Clock Delay, Clock GLB to Global GLB Clock Line 57 Clock Delay, Y2 or Y3 to I/O Cell Global Clock Line 58 Clock Delay, Clock GLB to I/O Cell Global Clock Line 59 Global Reset to GLB and I/O Registers - - - - 0.9 0.9 0.8 0.0 0.8 - 10.0 4.3 4.3 2.7 0.9 0.9 1.8 0.0 1.8 2.8 - - - - 2.0 2.0 0.8 0.0 0.8 - 10.0 5.1 5.1 3.9 2.0 2.0 1.8 0.0 1.8 4.3 # DESCRIPTION -125 -100 -90 UNITS
MIN. MAX. MIN. MAX. MIN. MAX. - 1.3 - 2.0 - 1.7
USE 104 8E-100 F OR NEW DE SIGNS
- - 12.0 6.4 6.4 - - 2.6 2.8 2.8 2.8 2.8 0.8 0.0 1.8 0.5 0.8 - 1.8 4.5
tob tsl toen todis tgoe
Clocks
49 Output Buffer Delay
ns ns ns ns ns ns ns ns ns ns ns
tgy0 tgy1/2 tgcp tioy2/3 tiocp
Global Reset
tgr
1. Internal timing parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details.
Table 2-0037A/1048E
9
Specifications ispLSI 1048E
Internal Timing Parameters1
PARAMETER Outputs 50 Output Slew Limited Delay Adder 51 I/O Cell OE to Output Enabled 52 I/O Cell OE to Output Disabled 53 Global OE 54 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 55 Clock Delay, Y1 or Y2 to Global GLB Clock Line 56 Clock Delay, Clock GLB to Global GLB Clock Line 57 Clock Delay, Y2 or Y3 to I/O Cell Global Clock Line 58 Clock Delay, Clock GLB to I/O Cell Global Clock Line 59 Global Reset to GLB and I/O Registers - - - - 2.8 2.8 0.8 0.1 0.8 - 12.0 6.9 6.9 5.1 2.8 2.8 1.8 0.6 1.8 4.5 # DESCRIPTION -70 -50 MIN. MAX. MIN. MAX. - 2.2 - 3.2 UNITS
USE 104 8E-70 FO R NEW DE SIGNS
- - 12.0 7.9 7.9 - - 8.1 3.3 3.3 0.0 3.3 3.3 0.7 0.8 0.8 - 1.8 1.8 7.5
tob tsl toen todis tgoe
Clocks
49 Output Buffer Delay
ns ns ns ns ns ns ns ns ns ns ns
tgy0 tgy1/2 tgcp tioy2/3 tiocp
Global Reset
tgr
1. Internal timing parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details.
Table 2-0037B/1048E
10
Specifications ispLSI 1048E
ispLSI 1048E Timing Model
I/O Cell GRP Feedback Ded. In #34 GRP4 #30 GRP Loading Delay #29, 31-33 Comb 4 PT Bypass GLB Reg Bypass #39 GLB Reg Delay D RST Reset #59 #40 - 43 Q ORP Bypass #48 ORP Delay #47 #49, 50 I/O Pin (Output) GLB ORP I/O Cell
#28 I/O Reg Bypass #22 Input D Register Q RST #23 - 27
I/O Pin (Input)
Reg 4 PT Bypass #35 20 PT XOR Delays #36 - 38
#51, 52
#59
Clock Distribution Y1,2,3 #55 - 58
Control RE PTs OE #44 - 46 CK
0491
Y0 GOE 0,1
#54 #53
Derivations of tsu, th and tco from the Product Term Clock 1 tsu
= = = 2.2 ns = = = = 3.5 ns = = = = 10.9 ns = Logic + Reg su - Clock (min) (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tiobp + tgrp4 + tptck(min)) (#22 + #30 + #37) + (#40) - (#22 + #30 + #46) (0.3 + 2.0 + 5.0) + (0.1) - (0.3 + 2.0 + 2.9) Clock (max) + Reg h - Logic (tiobp + tgrp4 + tptck(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor) (#22 + #30 + #46) + (#41) - (#22 + #30 + #37) (0.3 + 2.0 + 4.0) + (4.5) - (0.3 + 2.0 + 5.0) Clock (max) + Reg co + Output (tiobp + tgrp4 + tptck(max)) + (tgco) + (torp + tob) (#22 + #30 + #46) + (#42) + (#47 + #49) (0.3 + 2.0 + 4.0) + (2.3) + (1.0 + 1.3)
th
tco
Derivations of tsu, th and tco from the Clock GLB 1 tsu
= = = 3.4 ns = = = = 2.2 ns = = = = 9.6 ns = Logic + Reg su - Clock (min) (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tgy0(min) + tgco + tgcp(min)) (#22 + #30 + #37) + (#40) - (#54 + #42 + #56) (0.3 + 2.0 + 5.0) + (0.1) - (0.9 + 2.3 + 0.8) Clock (max) + Reg h - Logic (tgy0(max) + tgco + tgcp(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor) (#54 + #42 + #56) + (#41) - (#22 + #30 + #37) (0.9 + 2.3 + 1.8) + (4.5) - (0.3 + 2.0 + 5.0) Clock (max) + Reg co + Output (tgy0(max) + tgco + tgcp(max)) + (tgco) + (torp + tob) (#54 + #42 + #56) + (#42) + (#47 + #49) (0.9 + 2.3 + 1.8) + (2.3) + (1.0 + 1.3)
th
tco
1. Calculations are based upon timing specifications for the ispLSI 1048E-125.
Table 2-0042/1048E
11
Specifications ispLSI 1048E
Maximum GRP Delay vs. GLB Loads
10 9 8
GRP Delay (ns)
ispLSI 1048E-50
ispLSI 1048E-70 ispLSI 1048E-90/100 ispLSI 1048E-125
7 6 5 4 3 2 1 1 4 8 16 GLB Loads
0127A/1048E
32
48
Power Consumption
Power Consumption in the ispLSI 1048E device depends on two primary factors: the speed at which the device is operating and the number of Product Terms used. Figure Figure 3. Typical Device Power Consumption vs fmax
380 340 ispLSI 1048E
3 shows the relationship between power and operating speed.
ICC (mA)
300 260 220 180 0 20 40 60 80 100 120 140
fmax (MHz)
Notes: Configuration of twelve 16-bit counters, Typical current at 5V, 25C
ICC can be estimated for the ispLSI 1048E using the following equation: ICC = 20 + (# of PTs * 0.42) + (# of nets * Max. freq * 0.010) Where: # of PTs = Number of Product Terms used in design # of nets = Number of Signals used in device Max. freq = Highest Clock Frequency to the device The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of 4 GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified.
0127B/1048E
12
Specifications ispLSI 1048E
Pin Description
NAME
I/O 0 - I/O 5 I/O 6 - I/O 11 I/O 12 - I/O 17 I/O 18 - I/O 23 I/O 24 - I/O 29 I/O 30 - I/O 35 I/O 36 - I/O 41 I/O 42 - I/O 47 I/O 48 - I/O 53 I/O 54 - I/O 59 I/O 60 - I/O 65 I/O 66 - I/O 71 I/O 72 - I/O 77 I/O 78 - I/O 83 I/O 84 - I/O 89 I/O 90 - I/O 95 GOE0, GOE1 IN 2, IN 4 IN 6 - IN 11 ispEN/NC1
PQFP / TQFP PIN NUMBERS
21, 27, 34, 40, 52, 58, 66, 72, 85, 91, 98, 104, 117, 123, 2, 8, 64, 47, 84, 18 22, 28, 35, 41, 53, 59, 67, 73, 86, 92, 99, 105, 118, 124, 3, 9, 114 51 110, 111, 115, 116, 14 23, 29, 36, 42, 54, 60, 68, 74, 87, 93, 100, 106, 119, 125, 4, 10, 24, 30, 37, 43, 55, 61, 69, 75, 88, 94, 101, 107, 120, 126, 5, 11, 25, 31, 38, 44, 56, 62, 70, 76, 89, 95, 102, 108, 121, 127, 6, 12, 26, 32, 39, 45, 57, 63, 71, 77, 90, 96, 103, 109, 122, 128, 7, 13
DESCRIPTION
Input/Output Pins - These are the general purpose I/O pins used by the logic array.
Global Output Enable input pins. Dedicated input pins to the device. Input - Dedicated in-system programming enable input pin. This pin is brought low to enable the programming mode. When low, the MODE, SDI, SDO and SCLK controls become active. Input - This pin performs two functions. When ispEN is logic low, it functions as an input pin to load programming data into the device. SDI/IN 0 also is used as one of the two control pins for the ISP state machine. When ispEN is high, it functions as a dedicated input pin. Input - This pin performs two functions. When ispEN is logic low, it functions as pin to control the operation of the isp state machine. When ispEN is high, it functions as a dedicated input pin. Output/Input - This pin performs two functions. When ispEN is logic low, it functions as an output pin to read serial shift register data. When ispEN is high, it functions as a dedicated input pin. Input - This pin performs two functions. When ispEN is logic low, it functions as a clock pin for the Serial Shift Register. When ispEN is high, it functions as a dedicated input pin. Active Low (0) Reset pin which resets all of the GLB and I/O registers in the device. Dedicated Clock input. This clock input is connected to one of the clock inputs of all of the GLBs on the device. Dedicated Clock input. This clock input is brought into the clock distribution network, and can optionally be routed to any GLB on the device. Dedicated Clock input. This clock input is brought into the clock distribution network, and can optionally be routed to any GLB and/or any I/O cell on the device. Dedicated Clock input. This clock input is brought into the clock distribution network, and can optionally be routed to any I/O cell on the device.
SDI/IN 0
20
MODE/IN 1
46
SDO/IN 3
50
SCLK/IN 5
78
RESET Y0 Y1
19 15 83
Y2
80
Y3
79
GND VCC
1, 97, 16,
17, 112 48,
33, 82,
49, 113
65,
81,
Ground (GND) VCC
Table 2 - 0002C-48E
1. NC pins are not to be connected to any active signals, VCC or GND.
13
Specifications ispLSI 1048E
Pin Configuration
ispLSI 1048E 128-Pin PQFP Pinout Diagram
I/O 83 I/O 82 I/O 81 I/O 80 I/O 79 I/O 78 I/O 77 I/O 76 I/O 75 I/O 74 I/O 73 I/O 72 IN 10 IN 9 GOE 1 VCC GND IN 8 IN 7 I/O 71 I/O 70 I/O 69 I/O 68 I/O 67 I/O 66 I/O 65 I/O 64 I/O 63 I/O 62 I/O 61 I/O 60 GND 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97
GND I/O 84 I/O 85 I/O 86 I/O 87 I/O 88 I/O 89 I/O 90 I/O 91 I/O 92 I/O 93 I/O 94 I/O 95 IN 11 Y0 VCC GND 1ispEN/NC RESET SDI/IN 0 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
ispLSI 1048E
Top View
96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
I/O 59 I/O 58 I/O 57 I/O 56 I/O 55 I/O 54 I/O 53 I/O 52 I/O 51 I/O 50 I/O 49 I/O 48 IN 6 Y1 VCC GND Y2 Y3 SCLK/IN 5 I/O 47 I/O 46 I/O 45 I/O 44 I/O 43 I/O 42 I/O 41 I/O 40 I/O 39 I/O 38 I/O 37 I/O 36 GND
1. NC pins are not to be connected to any active signals, Vcc or GND.
0124-48C
GND I/O 12 I/O 13 I/O 14 I/O 15 I/O 16 I/O 17 I/O 18 I/O 19 I/O 20 I/O 21 I/O 22 I/O 23 MODE/IN 1 IN 2 VCC GND SDO/IN 3 IN 4 I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 I/O 30 I/O 31 I/O 32 I/O 33 I/O 34 I/O 35 GOE 0
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
14
Specifications ispLSI 1048E
Pin Configuration
ispLSI 1048E 128-Pin TQFP Pinout Diagram
128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97
I/O 83 I/O 82 I/O 81 I/O 80 I/O 79 I/O 78 I/O 77 I/O 76 I/O 75 I/O 74 I/O 73 I/O 72 IN 10 IN 9 GOE 1 VCC GND IN 8 IN 7 I/O 71 I/O 70 I/O 69 I/O 68 I/O 67 I/O 66 I/O 65 I/O 64 I/O 63 I/O 62 I/O 61 I/O 60 GND
GND I/O 84 I/O 85 I/O 86 I/O 87 I/O 88 I/O 89 I/O 90 I/O 91 I/O 92 I/O 93 I/O 94 I/O 95 IN 11 Y0 VCC GND ispEN RESET 1SDI/IN 0 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
ispLSI 1048E
Top View
96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
I/O 59 I/O 58 I/O 57 I/O 56 I/O 55 I/O 54 I/O 53 I/O 52 I/O 51 I/O 50 I/O 49 I/O 48 IN 6 Y1 VCC GND Y2 Y3 SCLK/IN 51 I/O 47 I/O 46 I/O 45 I/O 44 I/O 43 I/O 42 I/O 41 I/O 40 I/O 39 I/O 38 I/O 37 I/O 36 GND
1. Pins have dual function capability.
0124-48/TQFP
GND I/O 12 I/O 13 I/O 14 I/O 15 I/O 16 I/O 17 I/O 18 I/O 19 I/O 20 I/O 21 I/O 22 I/O 23 1MODE/IN 1 IN 2 VCC GND 1SDO/IN 3 IN 4 I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 I/O 30 I/O 31 I/O 32 I/O 33 I/O 34 I/O 35 GOE 0
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
15
Specifications ispLSI 1048E
Package Thermal Characteristics
For the ispLSI 1048E-125LT, it is strongly recommended that the actual Icc be verified to ensure that the maximum junction temperature (TJ) with power supplied is not exceeded. Depending on the specific logic design and clock speed, airflow may be required to satisfy the maximum allowable junction temperature (TJ) specification. Please refer to the Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM for additional information on calculating TJ.
Part Number Description ispLSI 1048E - XXX
Device Family Device Number Speed 125 = 125 MHz fmax 100 = 100 MHz fmax 90 = 90 MHz fmax 70 = 70 MHz fmax 50 = 50 MHz fmax
X
X
X
Grade Blank = Commercial I = Industrial Package Q = PQFP T = TQFP Power L = Low
0212/1048E
ispLSI 1048E Ordering Information
COMMERCIAL
FAMILY fmax (MHz) 125 125 100 100 ispLSI 90 90 70 70 50 50 tpd (ns) 7.5 7.5 10 10 10 10 15 15 20 20 ORDERING NUMBER ispLSI 1048E-125LQ ispLSI 1048E-125LT ispLSI 1048E-100LQ ispLSI 1048E-100LT ispLSI 1048E-90LQ* ispLSI 1048E-90LT* ispLSI 1048E-70LQ ispLSI 1048E-70LT ispLSI 1048E-50LQ** ispLSI 1048E-50LT** PACKAGE 128-Pin PQFP 128-Pin TQFP 128-Pin PQFP 128-Pin TQFP 128-Pin PQFP 128-Pin TQFP 128-Pin PQFP 128-Pin TQFP 128-Pin PQFP 128-Pin TQFP
Table 2-0041A/1048E
*Recommend 1048E-100 for new 1048E-90 designs. **Recommend 1048E-70 for new 1048E-50 designs.
INDUSTRIAL
FAMILY ispLSI fmax (MHz) 70 50 tpd (ns) 15 20 ORDERING NUMBER ispLSI 1048E-70LQI ispLSI 1048E-50LQI** PACKAGE 128-Pin PQFP 128-Pin PQFP
Table 2-0041B/1048E
**Recommend 1048E-70 for new 1048E-50 designs.
16


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